At Plastiform, we specialize in developing custom electronic packaging products such as this thermoformed electronics package system, which was designed for a customer who manufacturers delicate antenna assemblies. The previous packaging provided insufficient protection and left scratches on the product. Our skilled designers developed this lid and tray combination with perimeter snaps which provide ample protection from scratches and keep the product from becoming damaged during shipping and secondary handling. The 8″ x 8″ lid and tray are formed from conductive 0.045″ thick HIPS with a smooth black finish, and are designed to fit in the existing outer tray. The packaging must stay within dimensional tolerances of ±0.002″ to ensure a proper fit with the product and outer tray.
After the initial prototype was designed, trays were tested for fit and measured for material thickness. By developing this custom packaging solution, we were able to save the customer money in the manufacturing of the assembly. The customer also realized additional savings through the prevention of scratches and shipping damage. We produced a total of 500 of these trays with a lead time of 6 weeks. For more information about this thermoformed electronics packaging project, see the table below, or contact us directly.
(Click on thumbnail to enlarge)